3M Scotch-Weld 6011LV One-Part Low Viscosity Epoxy Adhesive for Electronics LED Lens Semiconductor Bonding

3M Scotch-Weld 6011LV One-Part Low Viscosity Epoxy Adhesive

The 3M™ Scotch-Weld™ 6011LV is a one-part, heat-cure epoxy adhesive with exceptionally low viscosity, engineered for precision bonding in electronics, LED, lens, and semiconductor applications. Its fluid consistency allows it to flow into tight gaps and fine features, delivering a strong, optically compatible bond with minimal stress on delicate components.

Key Features

• One-part system — no mixing required, ready to use
• Low viscosity for excellent flow into fine gaps and capillary spaces
• Heat-cure formulation for controlled, reliable processing
• High optical clarity after cure — suitable for lens and optical assemblies
• Strong adhesion to glass, metals, ceramics, and most plastics
• Excellent electrical insulation and chemical resistance

Applications

• LED lens bonding and encapsulation
• Semiconductor die attach and underfill
• Optical component assembly
• PCB and electronics component bonding
• Precision instrument and sensor manufacturing

Trusted by electronics engineers and manufacturers who need a reliable, low-stress adhesive solution for miniaturized and high-precision assemblies.