3M Scotch-Weld 6101 Off-White One-Part Epoxy Adhesive Low Temp Cure for Electronics Assembly

Product Overview

3M Scotch-Weld 6101 is an off-white, one-component epoxy adhesive engineered for low-temperature cure or fast elevated-temperature cure applications. It offers outstanding room-temperature storage stability and controlled thixotropic rheology for non-sag bonding on vertical surfaces — ideal for electronics assembly and precision industrial bonding.

Key Features

• Single-component formulation — no mixing required, ready to use
• Low-temperature cure: 80°C / 30 min; or fast cure: 125°C / 60 min
• Thixotropic, non-sag — suitable for vertical and overhead application
• Excellent impact resistance
• Strong adhesion to metals, PC, ABS, and glass-filled nylon
• Long room-temperature shelf life stability

Typical Applications

• Consumer electronics and mobile device assembly
• Wearable electronics bonding
• Miniaturized industrial bonding and sealing
• Structural bonding of metals and engineering plastics

Storage & Handling

Store under conditions specified in the product Technical Data Sheet (TDS). Keep away from high temperatures and humid environments. Verify the product is within its shelf life before use.