3M Scotch-Weld DP6330NS Green Multi-Material Composite Urethane Adhesive for Plastic Metal Wood Bonding

Product Overview

3M Scotch-Weld DP6330NS is a green, non-sag, two-component urethane adhesive designed for bonding a wide range of composites, plastics, metals and wood. According to 3M’s October 2025 technical data sheet, it is a high-strength bonder with some flexibility to accommodate thermal expansion and contraction differences in dissimilar material bonding.

DP6330NS can be used to attach composites to other substrates and may replace rivets and screws in certain applications, helping create a more aesthetically pleasing and fatigue-resistant bond line. 3M also states that it bonds well to most metals without requiring priming.

Key Features

• Green two-component urethane adhesive
• Designed for bonding composites, plastics, metals and wood
• Suitable for dissimilar material bonding
• Flexible bond line helps accommodate thermal expansion and contraction differences
• Non-sag paste formulation resists running and slumping
• 1:1 mix ratio by volume for convenient metering, mixing and dispensing
• Primerless bonding to most surfaces
• Excellent water and humidity resistance, with very good chemical resistance
• Room-temperature curing; cure can be accelerated with heat
• Can replace rivets and screws in some composite-to-substrate bonding applications
  

Typical Applications

3M DP6330NS is suitable for multi-material structural bonding, composite assembly and industrial manufacturing applications.

Typical applications include:

• Composite-to-metal bonding
• Composite-to-plastic bonding
• Composite-to-wood bonding
• Bonding CFRP, GFRP, SMC and other composite parts
• Bonding aluminum, stainless steel, galvanized steel and other metal substrates
• Bonding high surface energy plastics such as ABS and PC
• Multi-material industrial assembly
• Transportation, commercial vehicle and rail component bonding
• Structural bonding applications that may replace screws or rivets
• Assemblies requiring fatigue resistance, energy absorption and a cleaner bond line

Handling and Use Recommendations

• Avoid heavy pressure, dropping or cartridge deformation during handling.
• Before bonding, make sure the surface is clean, dry and free from paint, oxide films, oils, dust, mold release agents and other contaminants; 3M states that these contaminants should be completely removed to obtain the highest strength structural bonds.
• When using Duo-Pak cartridges, insert the cartridge into a 3M EPX applicator, dispense a small amount first to confirm that both components flow freely, then attach an EPX static mixing nozzle and begin dispensing.
• Apply the adhesive and join the surfaces within the open time, then keep parts from moving during cure.
• Allow the adhesive to cure at 16°C / 60°F or above until completely firm; applying heat up to 93°C / 200°F can increase cure speed.
• Excess uncured adhesive can be cleaned with ketone-type solvents. When using solvents, keep away from ignition sources and follow the solvent manufacturer’s safety instructions.