3M Scotch-Weld DP760 50ML High Temperature Epoxy Structural Adhesive for Metal and Glass Bonding

Product Overview

3M Scotch-Weld DP760 50ML is a white, two-part, room-temperature curing epoxy structural adhesive mainly used for industrial structural bonding applications that require high temperature resistance.

3M describes DP760 as a non-sag, two-part, room-temperature curing adhesive, making it suitable for structural bonding applications under high-temperature conditions.

This product offers excellent heat resistance. According to 3M product information, its temperature resistance can reach up to 230°C. It has an open time of approximately 45–60 minutes and reaches handling strength in about 4–6 hours. The 50ML product information also indicates that DP760 has a 70–90 minute work life, with high peel strength and shear strength, making it suitable for critical structural bonding applications.

The 50ML specification is supplied in a Duo-Pak cartridge and is suitable for use with 3M EPX dispensing equipment to achieve accurate metering, mixing and dispensing. This product can bond a variety of substrates, including wood, fiber-reinforced plastics, metals, glass, ceramics and some plastics.

Key Features

• Two-part epoxy structural adhesive, suitable for industrial structural bonding applications.
• White adhesive, suitable for applications requiring visible bond lines or high-temperature bonding.
• 2:1 mix ratio by volume, suitable for use with Duo-Pak / EPX dispensing systems.
• Non-sag formula, allowing the adhesive to stay in place without flowing easily, suitable for vertical surfaces, complex structures and precise dispensing.
• Room-temperature curing, allowing structural bonding without high-temperature curing equipment.
• High temperature resistance, with product information showing resistance up to 230°C, suitable for high-temperature and hot-humid bonding applications.
• Long working time, allowing enough time for positioning, adjustment and assembly.
• High peel strength and high shear strength, suitable for critical structural bonding.
• Good impact and fatigue resistance, suitable for demanding operating conditions.
• Can bond a wide range of materials, including wood, fiber-reinforced plastics, metals, glass, ceramics and some plastics.

Typical Applications

3M DP760 50ML is suitable for industrial structural bonding applications requiring high temperature resistance, high strength and long-term stability.

Typical applications include:

• Structural bonding under high-temperature conditions
• Metal-to-metal bonding
• Metal-to-glass bonding
• Metal-to-composite bonding
• Fiber-reinforced plastic / FRP bonding
• Bonding wood, glass, ceramics and some plastics
• Rail transportation component bonding
• Automotive and transportation equipment component bonding
• Industrial equipment and mechanical component assembly
• Structural fixing in high-temperature and high-humidity environments

Handling and Use Recommendations

• Avoid heavy pressure, dropping or deformation of the 50ML cartridge during handling.
• Before application, make sure the bonding surface is clean, dry and free from oil, dust, oxide layers, release agents and other contaminants.
• To achieve maximum structural bonding strength, these surface contaminants should be completely removed.
• Metal surfaces can be cleaned with acetone or isopropyl alcohol, then lightly sanded or sandblasted, and cleaned again.
• Plastic or rubber surfaces can be cleaned with isopropyl alcohol and lightly abraded.
• Glass surfaces can be cleaned with acetone or MEK, and a silane adhesion promoter may be used if required.
• When using a Duo-Pak cartridge, insert the cartridge into a 3M EPX applicator, dispense a small amount of adhesive first to confirm that both A and B components flow evenly, then attach the mixing nozzle for dispensing.
• After dispensing, assemble the parts within the open time and keep the workpieces fixed during curing to prevent displacement.
• The recommended curing temperature should not be lower than 16°C. Moderate heating up to 66°C can accelerate curing.
• Excess uncured adhesive can be cleaned with ketone-type solvents. When using solvents, keep away from ignition sources and follow the solvent supplier’s safety instructions.